multilayer ceramic chip capacitors 1 of 3 creation date : december 13, 2017 (gmt) cgj4j3x7t2d473k125aa tdk item description cgj4j3x7t2d473kt**** applications high reliability grade feature mid mid voltage (100 to 630v) aec-q200 aec-q200 series cgj4(2012) [eia 0805] status production size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 47nf 10% rated voltage 200vdc temperature characteristic x7t(+22,-33%) dissipation factor (max.) 2.5% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : december 13, 2017 (gmt) cgj4j3x7t2d473k125aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cgj4j3x7t2d473k125aa esr cgj4j3x7t2d473k125aa capacitance cgj4j3x7t2d473k125aa dc bias characteristic cgj4j3x7t2d473k125aa temperature characteristic cgj4j3x7t2d473k125aa(no bias) cgj4j3x7t2d473k125aa(dc bias = 100v ) ripple temperature rising cgj4j3x7t2d473k125aa(100khz) cgj4j3x7t2d473k125aa(500khz) cgj4j3x7t2d473k125aa(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : december 13, 2017 (gmt) cgj4j3x7t2d473k125aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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